New development projects require more complex, larger PCBAs and tighter packaging. multilayer pcb advantages,electronic components procurement,smt pcb assembly process,OEM service,pcb design price,manufacturer,supplier,Design,solution,price,These requirements challenge our ability to build and test these units. Furthermore, larger boards with smaller components and higher node counts will likely continue. For example, one design that is currently drawing a board diagram has approximately 116,000 nodes, more than 5100 components, and more than 37,800 solder joints that require testing or validation. This unit also has a BGA on the top and bottom, and the BGA is followed. One method of ICT is not possible using a conventional needle bed to test this size and complexity of the board.