Specification of this BGA Assembly SMT Assembly

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. Ball Grid Array packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The leads are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.PCBA Electronic Component,Electronic Component PCB Assembly,PCB Assembly SMT BGA,PCBA Assembly SMT BGA

The advent of BGA (ball grid array) definitely decreases assembly defects when SMT (surface mount technology) / SMD (surface mount device) practitioners find QFP (quad flat package) with pitch of 0.3mm incapable of ensuring SMT quality achievement.

We began BGA placement on a project from 2005 in a client’s Industrial Control Embedded board. Now we’ve gained techniques and built experience with various types of BGA assembly tasks. Some of these included placing BGAs on both the top and bottom sides of the printed circuit board. Now We assembled BAG without any problems.

We offers turn-key PCB assembly services in prototype quantities or low-volume to mid-volume production runs. We handle the whole process including: ordering all the components, PCB manufacturing, PCB assembly, testing and final shipment. We are capable of assembling BGA, Micro-BGA, QFN and other leadless package parts. We have ROHS, UL, ISO9001:2008 certificates for our service.

The one-stop destination of boards fabrication and assembly from OFAL will help you to make your R&D work easy and time-saving. Our professional engineers and technicians will work closely with you to ensure the best quality and quickest possible lead time. We focus on reducing your costs, speeding your products to market and helping you gain a competitive edge.

OFAL PCBA capabilities: SMT Assembly, BGA Assembly, Through-Hole Assembly, Mixed Assembly, Rigid Flex PCB Assembly Services.

The PCBs we can handle:

FR-4 / High TG FR-4 / Halogen Free material/Rogers/Arlon/Taconic/Teflon

Brand Name:OEM

Model Number:OEM/ODM

Base Material:FR4,High TG,FR1...

Copper Thickness:0.5-6oz

Board Thickness:1.6MM

Min. Hole Size:0.1mm

Min. Line Width:3mil

Min. Line Spacing:3mil

Surface Finishing:L-F HASL

Type:BMS

Certificate:SGS

Packaging & Delivery

Packaging Details

anti-static

Port

SHENZHEN
 
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